Flip-chip bonding
LED MING
以往在進行倒裝芯片鍵合時,必須在基板上使用昂貴的氮化鋁。這是因為價格低廉的金屬基板與LED芯片的熱膨脹係數存在很大差異,接合處容易破損。而在此次的技術中,作為接合材料的AuRoFUSE含有金顆粒,這些金顆粒可緩和熱膨脹時的變形,因此可使用價格低廉的金屬基板。
www.chi-ming.com ---kim@chi-ming.org
Trucking LED,Auto LED bulbs,Auto LED Lighting.Train LED Bulbs,Motorcycle LED Bulbs,Boat LED Bulbs,Truck LED Bulbs,Auto Parts LED,Motor LED Light. LED LAMPS, FESTOON LAMPS, WEDGE LAMPS
以往在進行倒裝芯片鍵合時,必須在基板上使用昂貴的氮化鋁。這是因為價格低廉的金屬基板與LED芯片的熱膨脹係數存在很大差異,接合處容易破損。而在此次的技術中,作為接合材料的AuRoFUSE含有金顆粒,這些金顆粒可緩和熱膨脹時的變形,因此可使用價格低廉的金屬基板。
www.chi-ming.com ---kim@chi-ming.org
Trucking LED,Auto LED bulbs,Auto LED Lighting.Train LED Bulbs,Motorcycle LED Bulbs,Boat LED Bulbs,Truck LED Bulbs,Auto Parts LED,Motor LED Light. LED LAMPS, FESTOON LAMPS, WEDGE LAMPS
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